Hoku Scientific, Inc. has signed a non-binding term sheet with MerrillLynch for Hoku Materials, Inc., capital requirements for itsunder-construction polysilicon production plant in Pocatello, Idaho.The loan of $185 million is conditional on Hoku Scientific raising afurther $35 million in cash for use in the construction of the plannedpolysilicon plant. The non-binding term sheet will expire on May 31,2008.