Comtec shifting focus to 145 micron and below ‘Super Mono Wafer’ as demand in Japan grows

August 30, 2013
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China-based monocrystalline wafer supplier, Comtec Solar Systems Group reported a wafer, ingot and polysilicon shipment increase of approximately 102% for the first-half of 2013, compared to the same period of 2012.

The company said that it was shifting its focus towards its ‘Super Mono Wafer’ substrates as it claimed there were a limited number of suppliers in the world that had been qualified to supply high-performance/quality mono wafers to leading international cell and module manufacturers.

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Comtec has previously claimed its mono-wafers can achieve average conversion efficiencies of over 23% with wafer thicknesses of 150 microns.

The company said it was planning to move production to 145 microns by the end of 2013, having had a Japanese customer qualify the wafers using diamond wire cutting.

Comtec said that its wafer thickness roadmap towards sub-120 micron thickness would be achieved in the ‘coming few years.’

Financial results

The company reported shipments increased 102.8% over the corresponding period in 2012 to 443.3MW, which included 179.6MW of wafers and approximately 263.7MW of polysilicon and ingots.

Revenue for the first-half of 2013 reached RMB471.0 million (US$76.9 million), compared to RMB456.2 million in the same period a year ago.

Comtec reported a gross profit margin of 8.6%, down from 12.5% as pricing pressure continued, according to the company.  Net loss for the period was approximately RMB12.1 million.

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