Dow Chemical develops special coolant for improved diamond wire ingot squaring

December 10, 2012
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The Dow Chemical Company has developed a diamond wire ingot squaring coolant that improves PV wafer manufacturing efficiency while also improving the sustainability of the production process. ENLIGHT DC-8300 is water-based and provides better cutting precision and efficiency

Problem

Next-generation diamond wire saws are designed to reduce overall PV manufacturing costs by using a higher cut speed and fixed abrasive technology instead of loose abrasive slurry for cutting. By improving the cutting precision and efficiency via new coolants could help accelerate the adoption of diamond wire cutting, helping the industry progress in its goal to reduce cost per watt.

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Solution

Because of its suspension and dispersion capabilities, ENLIGHT DC-8300 Coolant is claimed to reduce the percentage of bricks with high thickness variables. The coolant was said to have demonstrated during customer trials that it could significantly reduce ingot defects and was easy to handle, offering a clean ingot cutting process as it reduced stickiness issues on the guide roller and on the machine interior parts. The coolant could also sustain multiple rounds of cutting, thus helping to improve customers’ production efficiency.

Applications

Diamond wire ingot squaring

Platform

Water-based ENLIGHT DC-8300 Coolant offers an improved environmental profile than glycol-based coolants in the marketplace. In addition, it enables easier silicon powder separation, thus offering higher potential for waste silicon recycling.

Availability

September 2012 onwards.

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