Trina Solar targets 140 micron wafer thickness and 19 percent cell efficiencies in 2010

Trina Solar has provided manufacturing guidance for 2008 and beyond with the target of achieving cell efficiency rates of approximately 19 percent for monocrystalline solar cells by 2010. Importantly, Trina Solar expects to reduce wafer thickness to 140 microns by 2010 as part of its cost reduction strategies. Multicrystalline cell efficiencies are also expected to reach 18 percent in the same timeframe. Currently, the company plans to initiate production tests of 180-micron wafers and cells in the first half of 2008.

Trina Solar also said that it has pre-sold 100 percent and 75 percent of its first and second half 2008 targeted module production, respectively. This equates to approximately 85 percent of its targeted module production of 200-210MW for 2008.

The company also said that 80 percent of its estimated silicon feedstock requirements this year have been secured. It continues to source up to 80 percent of its feedstock requirements from reclaimed silicon sources, which the company claims results in cost savings of 30-50 percent over the spot market cost for virgin polysilicon.

With a target to produce 400MW of module production in 2009, the company has secured approximately 60 percent of its total feedstock requirements with long-term polysilicon contracts currently accounting for over 40 percent of its total 2009 silicon requirements.

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