DuPont Microcircuit Materials (MCM) has announced the release of its latest photovoltaic metallization paste, with 15% less silver than previous pastes. The introduction of the Solamet PV51M comes as part of the company’s continued attempts to reduce the silver content of its pastes by 20%, in the face of rising silver prices.
“Enabling our customers to achieve the highest efficiencies and lowest overall costs – in particular by reducing silver content – is a challenge the DuPont team embraces,” said Peter Brenner, global marketing manager of photovoltaics, MCM. “Solamet PV51M is just the latest example of our ability to bring creative thinking together with focused research to open up new scientific possibilities, and our experience in driving developments through to commercialization quickly continues to set us apart as a leader in metallization technology.”
MCM reports that the new tabbing paste has an electrical performance comparable to that of its Solamet PV505, and is co-firable with other frontside silver pastes in the Solamet line.