Independently verified by the ISE CalLab, SCHMID Group is championing 20.74% efficiency level for a PERC cell using its APCVD tool, which is being showcased at EU PVSEC, in Frankfurt this week. The cells employed a screen printed 3 busbar frontside, using Cz-Si wafers.
SCHMID said that it offers an economic backside passivation process with a cost of less than US$0.02/wafer. The company claimed that rival technologies such as PECVD or ALD processes would cost three to five times as much.
The APCVD tool can process various cell concepts like bifacial and IBC cells, while deposition of TiO2 and SiO2, PSG and BSG can be undertaken. The latter is especially relevant with the expected growth in n-type wafer usage.