With one month to go before the Solar and Off-Grid Renewables Southeast Asia conference in Bangkok, PV Tech caught up with Franck Constant, president of renewables and storage investment platform Constant Energy, to discuss the current state of solar in the largest Southeast Asian markets.
Heraeus Photovoltaics has introduced a new paste specifically designed for Diamond-Wire-Cut (DWC) multicrystalline solar cells at the PV Taiwan International Photovoltaic Exhibition.
PV Tech talked with PV Lighthouse’s Malcolm Abbot ahead of PV ModuleTech 2017, being held in Kuala Lumpur, Malaysia, on 7-8 November 2017. Malcolm will be a guest speaker at the event.
China-based polysilicon producer Daqo New Energy is to increase its capacity at its Xinjiang plant by 7,000MT, which is intended to serve the high-purity needs of monocrystalline solar wafers and the expanding semiconductor sector.
DK Electronic Materials Inc. (DKEM) has launched a new generation of front-side metallization paste. ‘DK92’ series front-side metallization pastes have been developed to be compatible with different passivation technologies and processes for PERC solar cells, including ALD (spatial ALD, and time-based dual-side passivated ALD), PECVD (remote plasma and direct plasma) as well as other non-AlOx passivation solutions to boost the diversified PERC technologies and to further lower the LCOE.
Norwegian firm Saga Energy has signed a preliminary agreement with Iranian state-run firm Amin Energy Developers to build solar plants requiring investment of €2.5 billion investment (US$2.9 billion) in Iran, according to a Reuters report.
Acciona Energía and Saudi Arabian firm Swicorp are to build and own three solar PV plants with a combined capacity of 186MW in the Benban solar complex in Aswan, Egypt.
‘Silicon Module Super League’ (SMSL) member GCL System Integrated Technology (GCL-SI) has secured its first order in Australia for its recently launched ‘Super 2.5 MW Solar Block’ modular plant system from Australian-based power station developer APSU Power.