direct wafer

US-based wafer producer 1366 Technologies has merged with Hunt Perovskite Technologies (HPT), with the combined company planning to bring to market tandem modules.

As the PV-Tech team evaluated the topics best suited for this year’s PV CellTech event (12-13 March 2019, Penang, Malaysia), it was clear that wafering should be a key theme for inclusion at the conference.

US-based wafer producer 1366 Technologies and ‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS have announced a new cells record of 20.3% using direct wafer technology.

US-Based wafer producer 1366 Technologies said that a small 500kW PV power plant in Hyōgo, Japan is the first commercial usage of its ‘Direct Wafer’ technology outside several test sites in the US, Germany and Japan.

US-Based wafer producer 1366 Technologies and ‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS have jointly achieved cell conversion efficiencies of 19.9%, up from 19.6% announced in December, 2016.

US-Based wafer producer 1366 Technologies and ‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS have jointly hit a new record of 19.6% efficiency for cells using the 'Direct wafer' process.

1366 Technologies has unveiled the first of a series of R&D achievements using its proprietary ‘Direct Wafer’ process to grow a three dimensional wafer or a thin wafer with a thick border, an advancement, deemed impossible with conventional ingot-based production technologies.

US-based ‘Direct Wafer’ producer, 1366 Technologies has secured a US$15 million equity investment and polysilicon supply deal from major polysilicon producer, Wacker Chemie.

US-Based ‘Direct Wafer’ producer, 1366 Technologies has secured US$10 million in funding from private equity firm, Hanwha Investment Corporation to support the building of its first major production facility at the at high-tech Science and Technology Advanced Manufacturing Park (STAMP) in Genesee County, New York.