US-listed Industrial adhesives supplier H.B. Fuller has said that after the acquisition of China-based adhesives specialist, TONSAN Adhesive, earlier in the year, it was working to develop new technologies for PV manufacturers.
‘Silicon Module Super League’ (SMSL) member JinkoSolar said that capacity of ingot/wafer, solar cell and solar modules would be expanded further in 2016 to meet growing demand.
‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS has said it expects to reach nameplate capacity of 5.2GW for both solar cells and modules by the middle of 2016 as the company continues major expansions in 2015.
Updated: Subsidaries of China-based polysilicon and PV module manufacturer LDK Solar have been forced into bankruptcy proceedings in China only shortly after the parent company, formerly listed in the US, exited bankruptcy proceedings of its own.
Major semiconductor equipment manufacturer Applied Materials is continuing to disengage from the solar equipment market after previously announcing its exit from Precision Wafering Systems (PWS) wire saw business, headquartered in Switzerland and stop development on its ‘Solion’ ion implant product, based in the US.
Updated: Major PV energy provider SunPower is to ramp Cogenra Solar’s module technology to 2GW by 2020 and only a further 800MW of its ‘Maxeon’ solar cell technology at its new facility, Fab 5 that it expects to ramp in early 2019.
PV manufacturer Zhongli Talesun has become the first of a wave of Chinese firms planning to establish manufacturing operations in Thailand to begin production in the Southeast Asian country.
PV furnace equipment specialist Tempress Systems a subsidiary of Amtech Systems has said it has won an order from a new customer in Taiwan, a repeat order from an existing Taiwanese customer and installed approximately 800MW of its next-generation diffusion systems at a leading Chinese solar cell and module manufacturer.
'Silicon Module Super League' member Canadian Solar is to allocate around US$401 million in capital expenditures through the end of 2016 to significantly increase in-house wafer, cell and module production capacity and locate new plants in multiple countries.
