SiTec GmbH has developed innovative monosilane process technology that provides substantial energy savings compared to legacy processes and increase capital productivity. Marketed under the name ‘STAR’, for SiTec Applied Research products, the technology is applicable to both new and existing (retrofit) monosilane plants.
Solvay Specialty Polymers has expanded its position in the PV market with the launch of two film grades of its ‘Halar’ ethylene chlorotrifluoroethylene (ECTFE) for photovoltaic (PV) modules. The two new high-performance products, Halar PV ECTFE and Halar ECTFE ultraviolet (UV) blocking technology have been specifically designed for frontsheet applications.
InnoLas Solutions is offering an automated laser cutting machine with an integrated soft wafer breaking process to produce half cells or quarter cells to reduce device-inherent resistivity, boosting overall module output by a claimed 10-15W.
Hitachi Chemical will begin sales of wavelength conversion particles (WCP) for solar encapsulant sheets that help increase the conversion efficiency of solar cell power generation. WCP series contains specialized phosphor within acrylic resin and converts short wavelength light (ultraviolet light) into long wavelength light (visible light).
Fujitsu Laboratories has announced the development of a technology for automatically generating image-recognition programs that accurately detect the positions of components as captured by cameras in automated assembly processes by utilizing images of electronic components and IT equipment.
DSM’s ‘KhepriCoat’ is claimed to maximize light transmission by minimizing reflection for solar cover glass, while boosting the cost/ performance ratio of solar energy. By enabling more-light to enter a solar device, KhepriCoat is claimed to significantly increase the device’s efficiency, and can make a major contribution in the quest for clean energy generation.
Meyer Burger is offering the DW 288+ as the first diamond wire saw system designed specifically for monocrystalline solar wafer applications. The DW 288 platform enables the slicing of silicon bricks into ultrathin wafers.
