DK Electronic Materials Inc. (DKEM) has launched a new generation of front-side metallization paste. ‘DK92’ series front-side metallization pastes have been developed to be compatible with different passivation technologies and processes for PERC solar cells, including ALD (spatial ALD, and time-based dual-side passivated ALD), PECVD (remote plasma and direct plasma) as well as other non-AlOx passivation solutions to boost the diversified PERC technologies and to further lower the LCOE.
Since the first demonstration by Sanyo in the 90s of crystalline silicon heterojunction (SHJ) solar cells with already promising energy conversion efficiencies above 18%, this device architecture has experienced an extraordinary history of development, embodying outstanding scientific findings and efficiency records.
Modern single metallization lines using flatbed screen printing (FSP) can realize a maximum output of approximately 2,000 wafers/h. For several reasons, achieving a significant further increase in throughput of the FSP process is technically challenging.
Major metallization paste producer Heraeus Photovoltaics said it had signed a major strategic partnership agreement with ‘Silicon Module Super League’ (SMSL) leader JinkoSolar that will focus on what the company said would be the development of a new generation of “Super PV Cells” with higher efficiencies and lower costs.
Major metallization paste producer Heraeus Photovoltaics has extended its supplier status with major China-based integrated PV module manufacturer, Tongwei Solar to collaborate on next-generation high-efficiency wafer and solar technologies.
Major metallization paste producer Heraeus Photovoltaics said it had lost a patent case against Taiwan-based Giga Solar in the Taiwanese Intellectual Property Court but noted it was reviewing the findings before deciding on an appeal.
Major materials supplier Heraeus Photovoltaics has entered into a new strategic technology partnership with China-based multicrystalline solar cell producer, Solar Space, also known as Zhonghui Photovoltaics (Jiangsu Solar Space Photovoltaic Technology Co.), which was established 2010.
For many applications, bifacial modules offer a cost-effective way of increasing energy yields, which explains why the interest in bifacial cells in the PV industry is steadily growing and is expected to continue. However, the metallization of bifacial cells creates new challenges, as the same materials and techniques developed for n surfaces are generally not directly, or simultaneously, applicable to p surfaces; this necessitates sequential metallization of each side, resulting in added cost and/or complexity. This paper introduces a simple co-plating approach with the objective of simplifying the metallization of bifacial cells in a cost-effective way, and which is designed for multi-wire module integration. The metallization route is described, and high cell efficiencies of up to 22.4% are demonstrated using this co-plating approach with bifacial nPERT+ cells (where ‘+’ signifies the bifacial nature of these cells). Initial thermal-cycling reliability data of test structures and 1-cell laminates is presented. Finally, cost-of-ownership (COO) estimates are given, which predict the co-plating approach to be ~40% cheaper than bifacial screen-printed metallization. It is shown that the combination of the high efficiency potential of nPERT+ cells and the reduced costs of co-plating has the potential to deliver module-level costs of ~$0.25/Wpe (glass–glass configuration).